Senju solder paste

Senju solder paste – Senju’s Sparkle Paste OZ series removes the ^‘im^‘ from ^‘impossible^‘. Formulated using a range of alloys, spherical, oxide zero solder powder with closely controlled particle distribution and highly stable flux technology Sparkle solder pastes exhibit outstanding printing characteristics. Sparkle fluxes can be used in Tin lead as well as lead free formulae. Controlled rheology enables crisp, fine pitch deposits to be printed without slumping, either with squeegees or pressurised print heads. Senju Sparkle Paste OZ series products are suitable for surface mount assembly and many other reflow soldering applications including component assembly, sealing, bumping, die bonding and induction soldering.