RGS 800 series
Features:
- Enables packaging of 0201 (mm) microchip components by using Type6.
- Ensures good wettability despite using Type6.
![rgs2 rgs2](https://salescon.hu/wp-content/uploads/2020/07/rgs2-600x300.jpg)
Soldering of 0201 (mm) components:
![rgs3 rgs3](https://salescon.hu/wp-content/uploads/2020/07/rgs3-500x300.jpg)
Ball-shaped solder alloy powder manufactured by our granulation technology:
![rgs800_03 rgs800_03](https://salescon.hu/wp-content/uploads/2020/07/rgs800_03-600x270.png)