RGS 800 series

    Applicable to type6 solder powder

Recommended alloy(s):     M705     M10    M14

  • Senju M705 – Senju SAC305 alloy
  • Senju M10 – Senju SnSb alloy
  • Senju M14 – Senju SnSb alloy

Features:

  • Enables packaging of 0201 (mm) microchip components by using Type6.
  • Ensures good wettability despite using Type6.
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Soldering of 0201 (mm) components:


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Ball-shaped solder alloy powder manufactured by our granulation technology:


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