SMIC offers an array of solutions in the form of the following alloys and forms that suit various objectives and applications.

• ・Peak temp.: Endothermic peak on a DSC (Differential Scanning Calorimetry) curve.
• ・Some alloy compositions may not be available in certain forms with special product size and grade.
• ・For inquiries regarding alloy compositions not listed, contact our sales representative.

The common name for Senju M705 alloy is SAC305. The name refers to the main components of the alloy: 96.5% tin (Sn), 3.0% silver (Ag) and 0.5% copper (Cu). SAC305 is a widely used lead-free solder.

Advantages of M705 – SAC30

• Excellent mechanical properties: Provides good strength and flexibility, resulting in reliable joints.
• Low melting point: melts at 217-220°C, which enables easy and efficient soldering.
• Good thermal and electrical conductivity: Provides reliable performance in electronic applications.
• Lead-free composition: Environmentally friendly and complies with RoHS (Restriction of Hazardous Substances) regulations.
• Stability: It has excellent wetting properties that ensure smooth and strong solder joints.

• Senju M31
• Senju M40
• Senju M705
• Senju M714
• Senju M10
• Senju M14
• Senju L29