JPP series
Reinforces the joint strength by flux
Features:
- Epoxy resin contained in flux contributes to the improvement of the drop and thermal resistance.
- Can be stored in a refrigerator.
- Applicable to flexible substrate such as polyamide and PET.
Optimal for joint reinforcement with components and improving drop impact resistance of brittle Sn-Bi solder:
Thermal cycle test:
Drop impact resistance test:
