JPP series

    Reinforces the joint strength by flux

 

Recommended alloy(s):     L20    M705

Features:

  • Epoxy resin contained in flux contributes to the improvement of the drop and thermal resistance.
  • Can be stored in a refrigerator.
  •  Applicable to flexible substrate such as polyamide and PET.

Optimal for joint reinforcement with components and improving drop impact resistance of brittle Sn-Bi solder:


 

jpp2

Thermal cycle test:


 

jpp3

Drop impact resistance test:


 

jpp4

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