ULT 369-series

ULT 369 series

  Updated universal solder paste

 

Recommended alloy(s):     M705

Features:

  • Improved printability and wettability.
  • Suppresses BGA Non-Wet Open (NWO) and voids
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Improved stencil life by suppressing the reaction between solder powder and flux

 

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Suppressed voids by improving flux fluidity

 

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