The Dip Tester DS-10S for Selective Soldering Equipment improves process management efficiency by measuring Solder temperature, Soldering time, temperature rising condition, moving speed and solder dimensions at once.

    • Solder Temp. Sensor (Special Feature for DS-10S): The sensor part with a small heat capacity accurately measure the solder temperature and atomosphere of the device.
    • Dip Time Sensor: Detect electrical continuity and measure solder contact time.
    • Pre-heat Sensor: Temperature sensor temperature rise and peak measurement in the sensor board allows relative control of the device state.
    • Measurement of Moving Speed: Measure the size of the nozzle by scanning X and Y on two dip time sensors.
    • Profile Measurement: Displays the profile of the solder temperature sensor and preheat sensor.
    • DS-10S Software: Perform various management such as OK/NG judgment and data analysis.
      (Pre-heat temp. Dip time, Solder temp. X-Y speed, Solder size X, Y and etc.)



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