SP-2

SP-2 is wettability testing machine for solder paste, parts electrode and PC board, adopted SP-Tension-Method (Temperature Profile Method)

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    • Can test and evaluate solder paste, PC board and parts-lead.
    • All wetting process can be observed from glass windows.
    • “Wetting Balance Measuring Method”,”Micro-Wetting Balance Measuring Method”, and “Quick Heating Method”     are possible optionally.
    • Can simulate reflow oven profile with hot air and N2 purge.
    • Electro-balance sensor adopted allows detection of very small force.The wettability of microchips can now be    examined by this unit.
    • Analyze wetting time and force with exclusive software.
    • Solder wire testing is also available.

 

Product specifications:

ItemSpecifications
Load SensorPrincipleElectro - balance sensor
Measurement range10.00gf~-5.00gf
Measurement accuracy *± (10mgf + 1 digit)
ResolutionLess than 900 mgf: 0.001 gf More than 900 mgf: 0.005 gf
Temp. SensorMeasurement range0~300℃
Measurement accuracy±3℃
Heater unitTemp. of heater unitRoom temperature ~ 300℃
O2 ConcentrationSimple closed heater unit with nipple for N2 purge test
Temp. profile setting1. Preheat temp.
2. Preheat time
3. The rate of temp. rise 3℃ /sec. (standard)
4. Maximum temp.
5. Maximum temp. time
Melting pointPreset solder paste melting point
Table movementAutomatic: operated by PC
Manual: operated by Up/Down switch (selectable 3 steps speed)
Digital outputRS-232C cable (Malcom format)
Air supplyOriginal air pressure: 0.2~0.5 Mpa (Approx. 2~5 kgf / cm2)
Adjustment air: 0.2 Mpa (Approx. 2kgf / cm2 )
Power supplyAC100V 50 / 60Hz 700W
WeightApprox. 20kg

*Load sensor accuracy is not concerned oscillation.

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