• The entire procedure, from Flux application (w/ Flux Temperature Control Function) to Measurement End is automated. Reducing unstable measurement results, and user error.
    • Complies with the Wetting test method according to JIS Z3198 (Lead Free Solder Test Method) standards.
    • Easily change Solder and Flux when necessary.
    • Electro-Balance Sensor detects a small force.
    • Efficiently analyze data with the exclusive PC software. (option)
    • An optional cover allows for wetting evaluation in a N2 environment. (option)
    • Micro Wetting Balance Measuring method is available.(option)


Product specifications:

Model NameSWB-2
Load sensorPrincipleElectro-Balance Sensor (EBS)
Measuring Range30mN - -30mN
Temp. SensorMeasuring Range0 - 450C
Insertion Time1 - 200s
Insertion Depth0.01 - 20.00mm (0.01mm step)
Insertion Speed0.1~30mm/s
Solder Temp. SettingRoom Temp. - 400C (Micro-wetting : Room Temp. - 320C)
Japanese StandardAutomatic Measurement (Flux Application, Removal and Measurement) JIS Z3198-4 and C60068-2-54 ,C60068-2-54,C6008-2-69 JEITA ET7411 (Solder Bath)
International StandardISO 9455-16 IEC 60068-2-54 and 60068-2-69 (Solder bath) ANSI J-STD-003, MIL STD-883 (Method 2022.2) and IPC TM-650 (
N2 MeasurementOxygen Concentration : 500ppm max. (optional)
Power SupplyAC100,115,220,240V (To be specifired when ordering) Approx 400W
Outer Dimension300(W)×330(D)×370(H)(mm)
WeightApprox. 16kg

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